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Copper alloy material for electric and the electronics components and method for producing the same (copper alloy material for electronic components and method for preparing the same)

机译:用于电气和电子部件的铜合金材料及其制造方法(用于电子部件的铜合金材料及其制备方法)

摘要

It is a copper alloy material for electric and electronic components and a method for producing the same. In particular, a copper alloy material with excellent mechanical strength characteristics, high electrical conductivity and high thermal stability as a material for the transmission of information, and electrical contact for plug connections or the like for household appliances and vehicles, including semiconductor-lead frames, and a method for producing the same.
机译:它是用于电气和电子部件的铜合金材料及其制造方法。特别地,具有优异的机械强度特性,高导电性和高热稳定性的铜合金材料作为信息传输的材料,以及用于家用电器和车辆的插头连接等的电接触,包括半导体引线框架,及其制造方法。

著录项

  • 公开/公告号DE102013018216A1

    专利类型

  • 公开/公告日2014-06-05

    原文格式PDF

  • 申请/专利权人 POONGSAN CORP.;

    申请/专利号DE20131018216

  • 发明设计人 CHEOL MIN PARK;IN YOUB HWANG;

    申请日2013-10-29

  • 分类号C22C9/06;H01B1/02;

  • 国家 DE

  • 入库时间 2022-08-21 15:37:26

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