DIPPING MECHANISM FOR DIE BONDER AND FLIP CHIP BONDER

摘要

PROBLEM TO BE SOLVED: To provide a dipping mechanism for die bonder capable of increasing the utilization of flux in a squeegee, and to provide a flip chip bonder of high utilization rate including the dipping mechanism.;SOLUTION: In a dipping mechanism for die bonder for supplying flux from an open mouth to a housing section by moving a squeegee, having a frame for housing the flux and the open mouth provided in the bottom of the frame (frame bottom), and a dipping plate having a housing section for housing the flux, relatively by a drive means, the frame bottom has a housing section upper part, separated by a predetermined height from the surface of the housing section, and moving above the housing section, and a travel part moving on the dipping plate on both sides of the housing section.;COPYRIGHT: (C)2016,JPO&INPIT