COPPER STOCK FOR HIGH-PURITY COPPER SPUTTERING TARGET, AND HIGH-PURITY COPPER SPUTTERING TARGET

摘要

PROBLEM TO BE SOLVED: To provide a copper stock for a high-purity copper sputtering target capable of depositing stably by suppressing occurrence of abnormal discharge, and producible inexpensively, and to provide a high-purity copper sputtering target comprising the copper stock for the high-purity copper sputtering target.SOLUTION: The purity of Cu excluding O, H, N, and C is in the range of 99.999980 mass% or higher and 99.999998 mass% or lower, the content of Al is 0.005 massppm or less, and the content of Si is 0.05 massppm or less.