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Plasma mediated ashing processes that include formation of a protective layer before and/or during the plasma mediated ashing process

机译:等离子体介导的灰化过程,包括在等离子体介导的灰化过程之前和/或期间形成保护层

摘要

A method for processing a substrate includes arranging a substrate including masked portions and unmasked portions in a process chamber; creating plasma in a process chamber; supplying a passivation gas mixture that includes nitrogen or carbon to create a plasma passivation gas mixture; exposing a substrate to the plasma passivation gas mixture to create a passivation layer on the unmasked portions of the substrate; supplying a stripping gas mixture that includes oxygen to the plasma to create a plasma stripping gas mixture; exposing the substrate to the plasma stripping gas mixture to strip at least part of the masked portions and at least part of the unmasked portions; and repeating creating the passivation layer and the stripping to remove a predetermined amount of the masked portions.
机译:一种用于处理基板的方法,该方法包括:将包括掩模部分和未掩模部分的基板布置在处理室中;以及在基板上设置基板。在处理室中产生等离子体;供应包含氮或碳的钝化气体混合物以产生等离子体钝化气体混合物;使衬底暴露于等离子体钝化气体混合物中,以在衬底的未掩盖部分上形成钝化层;将包含氧气的汽提气体混合物供应至等离子体以产生等离子体汽提气体混合物;使衬底暴露于等离子体汽提气体混合物中,以剥离至少一部分被掩盖的部分和至少一部分未被掩盖的部分;重复形成钝化层和剥离工序,以去除预定量的掩模部分。

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