SOLID-STATE IMAGE PICKUP ELEMENT, METHOD FOR DRIVING SOLID-STATE IMAGE PICKUP ELEMENT, METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP ELEMENT, AND ELECTRONIC APPARATUS

摘要

This solid-state image pickup element is provided with: a semiconductor layer having a first surface and a second surface that are facing each other; and a plurality of photodiodes that are laminated in the semiconductor layer. At least one photodiode among the photodiodes functions also as a transfer path for charges accumulated in other photodiodes.