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METHOD FOR REMOVING BY-PRODUCT OF ETCHING MRAM MATERIAL USING ATOMIC LAYER ETCHING EQUIPMENT

机译:利用原子层刻蚀设备去除刻蚀材料副产物的方法

摘要

Disclosed is a method for removing a by-product of etching a magnetic random access memory (MRAM) material, which can remove a MRAM material by minimizing a damage to the MRAM material. The method for removing a by-product of etching a MRAM material according to the present invention comprises: a first step of injecting adsorbing gas to the inside of a reaction chamber, and adsorbing the same onto a redeposition layer; a second step of discharging the remaining gas which has not been adsorbed onto the redeposition layer from the adsorbing gas to the outside of the reaction chamber; a third step of irradiating a reactive ion beam to the redeposition layer onto which the adsorbing gas has been adsorbed, and detaching the redeposition layer; and a fourth step of discharging a detached mixture to the outside of the reaction chamber.;COPYRIGHT KIPO 2016
机译:公开了一种去除蚀刻磁性随机存取存储器(MRAM)材料的副产物的方法,该方法可以通过最小化对MRAM材料的损坏来去除MRAM材料。根据本发明的用于去除蚀刻MRAM材料的副产物的方法包括:第一步,将吸附气体注入反应室内部,并将其吸附到再沉积层上;第二步骤是将未吸附在再沉积层上的残留气体从吸附气体排出到反应室的外部。第三步骤,向已吸附有吸附气体的再沉积层照射反应性离子束,并分离该再沉积层。第四步是将分离出的混合物排放到反应室外部。; COPYRIGHT KIPO 2016

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