首页> 外国专利> THERMAL CONDUCTIVE PARTICLE COMPOSITION, METHOD FOR PRODUCING THERMAL CONDUCTIVE PARTICLE COMPOSITION, THERMAL CONDUCTIVE RESIN COMPOSITION, AND THERMAL CONDUCTIVE RESIN CURED BODY

THERMAL CONDUCTIVE PARTICLE COMPOSITION, METHOD FOR PRODUCING THERMAL CONDUCTIVE PARTICLE COMPOSITION, THERMAL CONDUCTIVE RESIN COMPOSITION, AND THERMAL CONDUCTIVE RESIN CURED BODY

机译:导热颗粒组合物,导热颗粒组合物的制备方法,导热树脂组合物和导热树脂固化体

摘要

PROBLEM TO BE SOLVED: To provide a thermal conductive particle composition excellent in dispersibility and a method for producing the same; and to provide a resin composition which is produced using the thermal conductive particle composition and is excellent in thermal conductivity, and a cured body.;SOLUTION: A thermal conductive particle composition contains thermal conductive particle coarse powder and boron nitride fine powder. The thermal conductive particle composition excellent in dispersibility is obtained by the thermal conductive particle composition in which the boron nitride fine powder has a scale-like shape with an average particle diameter of 1-10 μm and an average thickness of 0.001-1 μm.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2016,JPO&INPIT
机译:解决的问题:提供分散性优异的导热性粒子组合物及其制造方法。并提供使用该导热性颗粒组合物制备的,具有优异的导热性的树脂组合物和固化体。解决方案:导热性颗粒组合物包含导热性颗粒粗粉和氮化硼细粉。通过其中氮化硼细粉具有平均粒径为1-10μm且平均厚度为0.001-1μm的鳞片状的导热颗粒组合物获得分散性优异的导热颗粒组合物。选图:图1;版权:(C)2016,JPO&INPIT

著录项

  • 公开/公告号JP2016155937A

    专利类型

  • 公开/公告日2016-09-01

    原文格式PDF

  • 申请/专利权人 DENKA CO LTD;

    申请/专利号JP20150034520

  • 发明设计人 IMAI TAKAHITO;FUKAZAWA MOTOHARU;

    申请日2015-02-24

  • 分类号C09K5/14;C08L101/00;C08K7/00;C08K3/00;C08G59/00;C01B21/064;

  • 国家 JP

  • 入库时间 2022-08-21 14:47:17

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