It is described a method for changing parameters for controlling a transfer of solder paste onto a printed circuit board (150, 250). The described method comprises (a) identifying first subareas (256, 258) of the printed circuit board (150, 250), which exhibit a first repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), (b) identifying second subareas (252, 254) of the printed circuit board (150, 250), which exhibit a second repeatability with respect to the amount of solder paste being supposed to be transferred onto the printed circuit board (150, 250), wherein the first repeatability is smaller than the second repeatability, (c) transferring solder paste onto the printed circuit board (150, 250) at least at the second subareas (252, 254) of the printed circuit board (150, 250), (d) measuring the amount of solder paste which has been transferred to the second subareas (252, 254), and (e) changing the parameters for controlling a transfer of solder paste onto the printed circuit board (150, 250) in response to the measured amount of solder paste which has been transferred to the second subareas (252, 254). It is further described a corresponding processing device, a system comprising such a processing device and a computer program for controlling and/or for carrying out such a method.
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