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Resistivity measuring method of the N-type silicon epitaxial layer

机译:N型硅外延层的电阻率测量方法

摘要

PROBLEM TO BE SOLVED: To provide a method which allows for measurement with good reproducibility, when measuring the resistivity of an N type silicon epitaxial layer by surface photovoltage method.;SOLUTION: A resistivity measurement method of an N type silicon epitaxial layer includes an oxide film removal step for removing the surface oxide film of the N type silicon epitaxial layer, an oxide film formation step for forming a new oxide film on the surface of the N type silicon epitaxial layer from which the surface oxide film is removed, and a depth of depletion layer measurement method for measuring the depth of a depletion layer formed in the vicinity of the surface of the N type silicon epitaxial layer by surface photovoltage method, by charging the surface of the new oxide film electrostatically by corona discharge.;COPYRIGHT: (C)2014,JPO&INPIT
机译:解决的问题:提供一种在通过表面光电压法测量N型硅外延层的电阻率时,能够以良好的再现性进行测量的方法;解决方案:N型硅外延层的电阻率测量方法包括氧化物膜去除步骤,用于去除N型硅外延层的表面氧化物膜;氧化膜形成步骤,用于在去除了表面氧化物膜的N型硅外延层的表面上形成新的氧化物膜;以及深度层测量方法的描述,用于通过表面光电压法通过电晕放电使新的氧化膜表面静电充电,来测量在N型硅外延层表面附近形成的耗尽层的深度。 C)2014,日本特许厅&INPIT

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