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LEAD FRAME STRUCTURE, METHOD OF MANUFACTURING LEAD FRAME STRUCTURE, AND SEMICONDUCTOR DEVICE
LEAD FRAME STRUCTURE, METHOD OF MANUFACTURING LEAD FRAME STRUCTURE, AND SEMICONDUCTOR DEVICE
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机译:引线框架结构,制造引线框架结构的方法以及半导体器件
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摘要
A lead frame structure includes a lead frame having a first surface, a second surface opposed to, and facing away from, the first surface, and a first through-hole extending through the lead frame from the first surface to the second surface, and a heat sink having a third surface contacting the second surface, a fourth surface opposed to, and facing away from, the third surface, and a second through-hole extending through the heat sink from the third surface to the fourth surface, and overlying the location of the first through-hole. The material of one of the heat sink and the lead frame extends through a through opening of the other of the heat sink and the lead frame and extends over a portion of the surface of the other of the heat sink and the lead frame on the second or fourth surfaces.
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