Bus Structure with sealed dielectric interface to semiconductor switch package input connections for reduced terminal spacing and lower inductance while meeting regulatory requirements

摘要

Semiconductor switch modules have positive and negative electrical input connections which must be spaced adequately to prevent a short circuit flashover between the polarities. This terminal spacing is defined by the strike distance through air or creepage distance through air along an insulating surface between the two input connections given the operating voltage per regulatory agency requirements. The inductance of the switch connections is ultimately limited by this terminal spacing. A novel conformal solid insulation scheme between the bus structure and switch module eliminates the strike or creepage paths through air and allows for reduced terminal spacing and lower inductance while meeting regulatory agency requirements.