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Methods and heat treatment apparatus for uniformly heating a substrate during a bake process
Methods and heat treatment apparatus for uniformly heating a substrate during a bake process
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机译:在烘烤过程中均匀加热基板的方法和热处理设备
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摘要
Methods and heat treatment apparatus for heating a substrate and any layer carried on the substrate during a bake process. A heat exchange gap between the substrate and a heated support is at least partially filled by a gas having a high thermal conductivity. The high thermal conductivity gas is introduced into the heat exchange gap by displacing a lower thermal conductivity originally present in the heat exchange gap when the substrate is loaded. Heat transfer across the heat exchange gap is mediated by the high thermal conductivity gas.
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