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amorphous multicomponent dielectrics based on the mixing of high k-band prohibited materials and their devices and fabrication

机译:高禁带禁带材料及其器件与制造混合的非晶多组分电介质

摘要

High performance thin-film, transistors are entirely processed at temperatures not exceeding 150° C., using amorphous multi component dielectrics based on the mixture of high band gap and high dielectric constant (K) materials. The sputtered or ink jet printed mixed dielectric materials such as Ta2O5 with SiO2 or Al2O3 or HfO2 with SiO2 or Al2O3 are used. These multicomponent dielectrics allow producing amorphous dielectrics to be introduced in high stable electronic devices with low leakage currents, while preserving a high dielectric constant. This results in producing thin film transistors with remarkable electrical properties, such as the ones produced based on GaInZn oxide as channel layers and where the dielectric was the combination of the mixture Ta2O5:SiO2, exhibiting field-effect mobility exceeding 35 cm2 V1 s1, close to 0 V turn-on voltage, on/off ratio higher than 106 and subthreshold slope below 0.24 V dec1.
机译:高性能薄膜晶体管在不超过150°C的温度下使用基于高带隙和高介电常数(K)材料的混合物的非晶多组分电介质进行整体处理。使用溅射或喷墨印刷的混合介电材料,例如带有SiO2的Ta2O5或Al2O3或带有SiO2或Al2O3的HfO2。这些多组分电介质允许在保持高介电常数的同时,以低漏电流将产生的非晶电介质引入到高稳定度的电子设备中。这导致生产出具有卓越电性能的薄膜晶体管,例如基于GaInZn氧化物作为沟道层而生产的薄膜晶体管,并且电介质是Ta2O5:SiO2混合物的组合,其场效应迁移率超过35 cm2 V1 s1,至0 V的开启电压,开/关比高于106,亚阈值斜率低于0.24 V dec1。

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