USE OF FILLER THAT UNDERGOES ENDOTHERMIC PHASE TRANSITION TO LOWER THE REACTION EXOTHERM OF EPOXY BASED COMPOSITIONS

摘要

Disclosed are curable epoxy-based resins having a lower peak exotherm duringcure, as well as thermoset resinsand epoxy-based parts formed from the curable epoxy-based compositions. Theepoxy-based compositions having a lower peakexotherm during cure may include: at least one epoxy resin, at least onehardener, and at least one endothermic transition additive.The thermoset resin may include the reaction product of the curable epoxy-based resins having a lower peak exotherm duringcure, which may be useful when forming large epoxy-based parts, such as thoseincluding 200 grams or more of the thermosetresin. Also disclosed is a process for forming curable epoxy-based resinshaving a lower peak exotherm during cure, including:admixing at least one epoxy resin; at least one hardener; and at least oneendothermic transition additive; to form a curable composition.The resulting curable composition may then be thermally cured at a temperatureof at least 60°C to form a thermosetresin.