PLASMA PROCESSING SYSTEMS WITH MECHANISMS FOR CONTROLLING TEMPERATURES OF COMPONENTS

摘要

the plasma processing system is described with improved temperature control components. The system may include a plasma processing chamber having a chamber wall. The system also may include an electrode disposed within the plasma processing chamber. In addition, the system may include a support member disposed in the plasma processing chamber to support the electrode. The system may also include a support plate disposed outside the chamber wall. In addition, the system may include a cantilever disposed through the chamber wall to a support member coupled to the support plate. The system may also include a lift plate disposed between the chamber wall and the support plate. In addition, the system may comprise a heat resistant coupling mechanism for mechanically coupling the lift plate to the support plate.