首页> 外国专利> ACTUAL THERMAL BONDING APPARATUS FOR ACTUALLY THERMALLY BONDING FILM TO LEAD MATERIAL BY USING HIGH-FREQUENCY INDUCER

ACTUAL THERMAL BONDING APPARATUS FOR ACTUALLY THERMALLY BONDING FILM TO LEAD MATERIAL BY USING HIGH-FREQUENCY INDUCER

机译:使用高频感应器将实际热粘合膜粘合到铅材料的实际热粘合装置

摘要

The purpose of the present invention is to actually thermally bond a film to a lead material in a noncontact method. The present invention relates to an actual thermal bonding apparatus for actually thermally bonding a film to a lead material by using a high-frequency inducer, and more specifically, to an apparatus for actually thermally bonding a film to a lead material in a noncontact method by using a high-frequency inducer. According to the present invention, the actual thermal bonding apparatus for actually thermally bonding a film to a lead material by using a high-frequency inducer comprises: a film supplying and cutting part which receives a first film and a second film and cuts the first film and the second film in predetermined sizes; a lead material supplying part which receives a lead material; a temporary thermal bonding part which supplies the first film to the upper end of the lead material heated by a high-frequency inducer, supplies the second film to the lower end of the lead material, and temporarily thermally bonds the supplied first film and second film to the lead material; an actual thermal bonding part which comprises a mounting member rotating around the center thereof and having a mounting part formed on the end of the mounting member to mount the lead material temporarily thermally bonded with the films, and which actually thermally bonds the lead material temporarily thermally bonded with the films by using the high-frequency inducer; an inspection part which inspects whether there is a thermal bond failure in the lead material actually thermally bonded with the films; and a discharge part which discharges a defectively thermally bonded lead material to a failure discharge unit, and discharges a normally thermally bonded lead material to a normal discharge unit, according to the result of inspection in the inspection part.;COPYRIGHT KIPO 2016
机译:本发明的目的是实际上以非接触方法将膜热粘合到引线材料上。实际的热粘合设备技术领域本发明涉及一种通过使用高频感应器将膜实际热粘合到引线材料的实际热粘合设备,更具体地,涉及一种通过非接触法将膜实际地热粘合到引线材料的设备。使用高频感应器。根据本发明,用于通过使用高频感应器将膜与引线材料实际热粘合的实际热粘合设备包括:膜供给和切割部分,其接收第一膜和第二膜并切割第一膜。预定尺寸的第二膜;铅材料供给部,其接收铅材料。临时热结合部,其将第一膜供应到由高频感应器加热的引线材料的上端,将第二膜供应到引线材料的下端,并暂时热粘结所供应的第一膜和第二膜铅材料;实际的热粘合部分,其包括绕其中心旋转的安装构件,并具有形成在安装构件的端部的安装部分,用于安装与膜临时热粘合的引线材料,并且实际上将其暂时热粘合通过使用高频感应器与薄膜结合;检查部检查在实际上与膜热粘接的引线材料中是否存在热粘接不良。根据检查部的检查结果,将不良地热接合的铅材料排出到故障排出单元,并且将正常地热接合的铅材料排出到正常排出单元的排出部。COPYRIGHTKIPO 2016

著录项

  • 公开/公告号KR20160120452A

    专利类型

  • 公开/公告日2016-10-18

    原文格式PDF

  • 申请/专利权人 GLOBAL-TECH CO. LTD.;

    申请/专利号KR20150049450

  • 发明设计人 LEE WON HWANKR;

    申请日2015-04-08

  • 分类号B29C65/02;B29C65/72;

  • 国家 KR

  • 入库时间 2022-08-21 14:13:20

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号