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ACTUAL THERMAL BONDING APPARATUS FOR ACTUALLY THERMALLY BONDING FILM TO LEAD MATERIAL BY USING HIGH-FREQUENCY INDUCER
ACTUAL THERMAL BONDING APPARATUS FOR ACTUALLY THERMALLY BONDING FILM TO LEAD MATERIAL BY USING HIGH-FREQUENCY INDUCER
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机译:使用高频感应器将实际热粘合膜粘合到铅材料的实际热粘合装置
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摘要
The purpose of the present invention is to actually thermally bond a film to a lead material in a noncontact method. The present invention relates to an actual thermal bonding apparatus for actually thermally bonding a film to a lead material by using a high-frequency inducer, and more specifically, to an apparatus for actually thermally bonding a film to a lead material in a noncontact method by using a high-frequency inducer. According to the present invention, the actual thermal bonding apparatus for actually thermally bonding a film to a lead material by using a high-frequency inducer comprises: a film supplying and cutting part which receives a first film and a second film and cuts the first film and the second film in predetermined sizes; a lead material supplying part which receives a lead material; a temporary thermal bonding part which supplies the first film to the upper end of the lead material heated by a high-frequency inducer, supplies the second film to the lower end of the lead material, and temporarily thermally bonds the supplied first film and second film to the lead material; an actual thermal bonding part which comprises a mounting member rotating around the center thereof and having a mounting part formed on the end of the mounting member to mount the lead material temporarily thermally bonded with the films, and which actually thermally bonds the lead material temporarily thermally bonded with the films by using the high-frequency inducer; an inspection part which inspects whether there is a thermal bond failure in the lead material actually thermally bonded with the films; and a discharge part which discharges a defectively thermally bonded lead material to a failure discharge unit, and discharges a normally thermally bonded lead material to a normal discharge unit, according to the result of inspection in the inspection part.;COPYRIGHT KIPO 2016
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