SYSTEMS AND METHODS FOR ELECTROLESS PLATING OF THIN GOLD FILMS DIRECTLY ONTO SILICON NITRIDE AND INTO PORES IN SILICON NITRIDE

摘要

A method is disclosed for electroless plating of thin metal film directly onto a substrate. The method includes the steps of: cleaning the substrate to remove organic material; etching a surface of the substrate to remove an oxygen-containing surface layer; soaking and rinsing the substrate in a plurality of baths following etching; and electroless plating the metal onto the substrate.