首页> 外国专利> heat conducting device for removing heat from an electrical component, film for adhering to a body of a heat conducting device, and, combination of a heat conducting device

heat conducting device for removing heat from an electrical component, film for adhering to a body of a heat conducting device, and, combination of a heat conducting device

机译:用于从电子部件中去除热量的导热装置,用于粘附到导热装置主体的薄膜以及导热装置的组合

摘要

heat conducting device for removing heat from an electrical component, film for adhering to a body of a heat conducting device, and, combination of a heat conducting device the present invention provides a heat conducting device (10) for removing heat of an electrical component (12) operating in a frequency range, wherein the device comprises a body (13) with first thermal conductivity, characterized in that the body (13) is equipped with a heat spreader (14) comprising a standard of heat-conductive tiles (20, 50, 51, 52, 61) separated by gaps (21), wherein the tiles have a second higher thermal conductivity than the first thermal conductivity, each tile has a maximum area value and the gaps have at least minimum gap width and the maximum area and minimum width are sized to conform to a predetermined electromagnetic interference. of the heat conducting device when in combination with the electrical component operating in the frequency range. The present invention also provides a method of forming a heat conductive device. 1/1
机译:本发明提供一种用于从电气部件去除热量的导热装置,用于粘附到导热装置的主体上的膜以及导热装置的组合,该导热装置用于去除电气部件的热量(10)。 12)在一个频率范围内运行,其中该设备包括具有第一导热率的主体(13),其特征在于,该主体(13)配备有散热器(14),该散热器包括标准的导热砖(20), 50、51、52、61)由间隙(21)隔开,其中图块的导热率比第一导热率高,每个图块的最大面积值大,并且至少具有最小的间隙宽度和最大面积最小宽度和最小宽度的大小应符合预定的电磁干扰。当与在该频率范围内运行的电气组件结合使用时,热传导装置的结构会发生变化。本发明还提供一种形成导热装置的方法。 1/1

著录项

  • 公开/公告号BR112015009332A2

    专利类型

  • 公开/公告日2017-07-04

    原文格式PDF

  • 申请/专利权人 TP VISION HOLDING B.V.;

    申请/专利号BR20151109332

  • 申请日2013-10-15

  • 分类号H01L23/36;H01L23/373;H01L23/66;

  • 国家 BR

  • 入库时间 2022-08-21 13:40:12

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