Additive electroplating for depositing an alloy of a group IB metal / binary or ternary group IB-group IIIA / ternary, quaternary or quinary Group IB, IIIA-group VIA group

摘要

A metal plating composition comprising one kind of group IB plating species and group IIIA plating characterized further comprise an additive of general formula (A): Formula ** ** wherein X1 and X2 may be the same or different and are selected from the group consisting of arylene and heteroarylene; FG1 and FG2 may be the same or different or are selected from the group consisting of -S (O) 2OH, - S (O) OH, -COOH, -P (O) 2OH and primary, secondary and tertiary amino groups and salts and esters thereof; R is selected from the group consisting of alkylene, arylene or heteroarylene and n and m are integers between 1 and 5.