Method for preparing multi-layer printed circuit board using conductive copper ink and light sintering and the multi-layer printed circuit board prepared therefrom

摘要

The invention The present invention relates to a multi-layer printed circuit board manufactured from the manufacturing method of the multilayered printed circuit board using a conducting copper ink and the light sintering and which, specifically, is more, the via-holes in predetermined portions of a) a substrate forming; b) preparing a double-sided printed circuit board by coating and drying the copper conductive ink to a substrate having a via-hole in the upper surface and the back surface; c) the light sintering of the two-sided printed circuit board; d) forming a blind via hole or a through hole for after laminating the a) to c) a plurality of double-sided printed circuit board produced by repeating the steps, the interlayer connection; And e) relates to the blind via hole or a copper conductive ink and a method of manufacturing the multilayer printed circuit board using a light sintered to the through hole includes a step of printing and sintering an optical and multi-layer printed circuit board prepared therefrom. According to the present invention, inexpensive and simple to manufacture a multilayer printed circuit board having an excellent electrical conductivity in a short time, the produced multilayer printed circuit board which may be generated at the time, yet suitable for a high density and miniaturization, printed and sintered filling insufficient or does not have the problems of insufficient sintering. Also, R2R face of the process connection is available white light sintering process and optimization, it is possible to achieve a mass production, RFID (Radio Frequency Identification Device), flexible electronics (Flexible Electronics), wearable electronics (Wearable Electronics), a large-area display It can be widely applied to high value-added products such as laminated solar cells, laminated battery. ;