TRANSFER BODY OF LIGHT EMITTING DIODE STRUCTURE ARRAY WITH DRY BONDING STRUCTURE, AND LIGHT EMITTING DIODE STRUCTURE ARRAY TRANSFER METHOD AND LIGHT EMITTING DIODE STRUCTURE USING SAME

摘要

An objective of the present invention is to provide a transfer body of a light emitting diode (LED) structure array with a dry adhesive structure, capable of maintaining an adhesive force with an LED structure, and easily removing and moving a mother substrate used for growth from the LED structure and to other substrates even in a repetitive transfer process of an individual LED structure or an LED structure array in a process to manufacture the LED structure array; and an LED structure array transfer method and an LED structure using the same. To this end, a fiber unit, which is the transfer body, arranged on a body unit in an arbitrary pattern forms a Van der Waals or capillary attractive force through contact with the LED structure, which is a transfer target, to maintain an adhesive force with the LED structure. Accordingly, even in the repetitive transfer process of the individual LED structure or the LED structure array in the process to manufacture the LED structure array, the adhesive force with the LED structure can be maintained through a dry adhesive transfer body, and allows the easy removal and movement of the mother substrate used for growth from the LED structure to other substrates.;COPYRIGHT KIPO 2017