首页> 外国专利> TREATMENT OF GATE DIELECTRIC FOR MAKING HIGH PERFORMANCE METAL OXIDE AND METAL OXYNITRIDE THIN FILM TRANSISTORS

TREATMENT OF GATE DIELECTRIC FOR MAKING HIGH PERFORMANCE METAL OXIDE AND METAL OXYNITRIDE THIN FILM TRANSISTORS

机译:用于制造高性能金属氧化物和金属氧氮化物薄膜晶体管的门电介质的处理

摘要

Embodiments of the present invention generally include TFTs and methods for their manufacture. The gate dielectric layer in the TFT can affect the threshold voltage of the TFT. The threshold voltage can be improved by treating the gate dielectric layer prior to depositing the active channel material. One method of treating the gate dielectric involves exposing the gate dielectric layer to N 2 O gas. Another method of treating the gate dielectric involves exposing the gate dielectric layer to a N 2 O plasma. Although silicon oxide is not practical as a gate dielectric for silicon-based TFTs, it may improve the threshold voltage when used in metal oxide TFTs. By treating the gate dielectric and / or using silicon oxide, the threshold voltage of the TFTs can be improved.
机译:本发明的实施例通常包括TFT及其制造方法。 TFT中的栅极介电层会影响TFT的阈值电压。可以通过在沉积有源沟道材料之前处理栅极介电层来提高阈值电压。处理栅极电介质的一种方法包括将栅极电介质层暴露于N 2 O气体。处理栅极电介质的另一种方法包括将栅极电介质层暴露于N 2 O等离子体。尽管氧化硅不能用作基于硅的TFT的栅极电介质,但是当用于金属氧化物TFT时,它可以提高阈值电压。通过处理栅极电介质和/或使用氧化硅,可以提高TFT的阈值电压。

著录项

  • 公开/公告号KR101774520B1

    专利类型

  • 公开/公告日2017-09-04

    原文格式PDF

  • 申请/专利号KR20117002859

  • 发明设计人 예 얀;

    申请日2009-06-29

  • 分类号H01L29/786;G02F1/136;

  • 国家 KR

  • 入库时间 2022-08-21 13:24:55

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