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METAL FILM POLISHING PAD AND METHOD FOR POLISHING METAL FILM USING THE SAME
METAL FILM POLISHING PAD AND METHOD FOR POLISHING METAL FILM USING THE SAME
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机译:金属膜抛光垫和使用该膜抛光金属膜的方法
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摘要
Provided are a polishing pad that makes it possible to improve the flatness of the polished surface and planarization efficiency, with fewer scratches, in polishing a metal layer formed on a semiconductor substrate and the like, and a method of polishing a metal layer using the polishing pad. A polishing pad for metal layer wherein the storage elastic modulus at 80°C is 200 to 900 MPa and the storage elastic modulus at 110°C is 40 MPa or less, and a method of polishing a metal layer using the pad.
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