Resin composition, adhesive, cover lay film, bonding sheet, copper-clad laminate and electromagnetic wave shielding material

摘要

PROBLEM TO BE SOLVED: To provide a resin composition having low dielectric and good storage stability.SOLUTION: There is provided a resin composition containing (A) a thermosetting resin, (B) a functional group-containing olefin polymer having glass transition temperature Tg of -140°C to 0°C and (C) a propylene α-olefin copolymer satisfying following (i) and (ii). (i) weight average molecular weight measured by GPC (Mw) is in a range of 3,000 to 40,000. (ii) the melting point measured by DSC (Tm) is in a range of 60 to 110°C.SELECTED DRAWING: None