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BULK DIRECT GAP MOS2 BY PLASMA INDUCED LAYER DECOUPLING

机译:等离子体诱导层去耦的本体直接间隙MOS2

摘要

Bulk direct transition metal dichalcogenide (TMDC) may have an increased interlayer separation of at least 0.5, 1, or 3 angstroms more than its bulk value. The TMDC may be a bulk direct band gap molybdenum disulfide (MoS2) or a bulk direct band gap tungsten diselenide (WSe2). Oxygen may be between the interlayers. A device may include the TMDC, such as an optoelectronic device, such as an LED, solid state laser, a photodetector, a solar cell, a FET, a thermoelectric generator, or a thermoelectric cooler. A method of making bulk direct transition metal dichalcogenide (TMDC) with increased interlayer separation may include exposing bulk direct TMDC to a remote (aka downstream) oxygen plasma. The plasma exposure may cause an increase in the photoluminescence efficiency of the TMDC, more charge neutral doping, or longer photo-excited carrier lifetimes, as compared to the TMDC without the plasma exposure.
机译:块状直接过渡金属二硫化氢(TMDC)的层间间距可能比其块状值大至少0.5、1或3埃。 TMDC可以是块状直接带隙二硫化钼(MoS2)或块状直接带隙二硒化钨(WSe 2 )。氧气可能在中间层之间。设备可以包括TMDC,例如光电设备,例如LED,固态激光器,光电检测器,太阳能电池,FET,热电发生器或热电冷却器。制备具有增加的层间分离度的本体直接过渡金属二硫化二氢(TMDC)的方法可以包括将本体直接TMDC暴露于远程(也称为下游)氧等离子体中。与没有等离子体暴露的TMDC相比,等离子体暴露可能会导致TMDC的光致发光效率提高,更多的电荷中性掺杂或更长的光激发载流子寿命。

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