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Printed circuit board including differential transmission lines thereon and having a conductive structure which provides immunity to common-mode noise

机译:印刷电路板,其上包括差分传输线,并具有可抵抗共模噪声的导电结构

摘要

A design for printed circuit board with reduced susceptibility to common-mode noise includes a first substrate, a differential pair of signal lines with two differential transmission lines laid on the first substrate, a second substrate, a metal layer located between the first substrate and the second substrate, and a grounding layer The second substrate is located between the second substrate and the grounding layer, and a conductive structure is located in the second substrate and couples the metal layer to the grounding layer. A length of the metal layer is substantially equal to a length of each of the two differential transmission lines.
机译:一种对共模噪声敏感度降低的印刷电路板设计,包括:第一基板,一对差分信号线和两条置于第一基板上的差分传输线,第二基板,位于第一基板和第二基板之间的金属层。第二基板和接地层第二基板位于第二基板和接地层之间,并且导电结构位于第二基板中并且将金属层耦合至接地层。金属层的长度基本上等于两条差分传输线中的每条的长度。

著录项

  • 公开/公告号US9907160B2

    专利类型

  • 公开/公告日2018-02-27

    原文格式PDF

  • 申请/专利权人 HON HAI PRECISION INDUSTRY CO. LTD.;

    申请/专利号US201615157339

  • 发明设计人 CHIH-HAO LIN;

    申请日2016-05-17

  • 分类号H05K1/02;H05K1/14;H05K1/11;H01P3/02;

  • 国家 US

  • 入库时间 2022-08-21 12:54:58

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