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Light for underwater use and its manufacturing method

机译:水下灯及其制造方法

摘要

Light (10, 100, 170) for underwater use, light comprising: a rear housing component (18) that includes a rear wall having an internal surface, the rear housing component (18) being formed at least in part of an electrically insulating and thermally conductive polymeric material; an electronic assembly (40, 42) having a front surface and a rear surface, including the front surface at least one light emitting element (114) mounted therein, the electronic assembly in thermal communication with the rear housing component (18); characterized by a thermally conductive material located between and in contact with the rear surface of the electronic assembly and the inner surface of the rear wall; and a lens (12) mounted on the rear housing component (18) and forming a water-tight seal between them, the lens (12) and the rear housing component (18) enclosing the electronic assembly (40, 42 ); wherein one of the rear housing component (18) and the lens (12) further comprises an annular recess (34) to receive an annular projection (32) formed in the other of the rear housing component (18) and the lens (12), the annular projection (32) being inserted in the annular recess (34) to enclose the electronic assembly and form the water-tight seal between the rear housing component (18) and the lens (12); wherein said thermally conductive material transfers heat from said electronic assembly to said rear housing component, and at least a part of the rear housing component (18) conducts heat away from the electronic assembly (40, 42) to cool the electronic assembly ( 40, 42).
机译:用于水下的灯(10、100、170),该灯包括:后壳体组件(18),其包括具有内表面的后壁,后壳体组件(18)至少部分地由电绝缘和导热聚合材料;一种电子组件(40、42),其具有前表面和后表面,所述电子组件与所述后壳体部件(18)热连通,所述电子表面包括至少一个安装在其中的发光元件(114)。其特征在于,位于电子组件的后表面和后壁的内表面之间并与之接触的导热材料;透镜(12)安装在后壳体部件(18)上并在它们之间形成水密密封,透镜(12)和后壳体部件(18)包围电子组件(40、42)。其中,后壳体部件(18)和透镜(12)中的一个进一步包括环形凹槽(34),以容纳形成在后壳体部件(18)和透镜(12)中的另一个中的环形突起(32)。环形突起(32)插入环形凹槽(34)中以包围电子组件并在后壳体部件(18)和透镜(12)之间形成水密密封;其中,所述导热材料将热量从所述电子组件传递到所述后壳体组件,并且后壳体组件(18)的至少一部分将热量从电子组件(40、42)传导走,以冷却电子组件(40, 42)。

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