A thermal deformation amount calculation device analyzes thermal deformation occurring in a product during manufacture thereof in which a material is successively laminated and heat input is performed by a three-dimensional lamination device. One layer is composed of a plurality of heat-input parts representing units of heat input from the three-dimensional lamination device. The thermal deformation amount calculation device is provided with: a heat-input pattern reception unit that receives a heat-input pattern representing an order by which the plurality of heat-input parts are subjected to heat input; a constraint condition extraction unit that extracts constraint conditions in each of the plurality of heat-input parts on the basis of the heat-input pattern; an inherent strain determination unit that calculates inherent strain in each of the plurality of heat-input parts on the basis of the constraint conditions; and a thermal deformation amount determination unit that calculates thermal deformation of the product on the basis of the inherent strain in each of the plurality of heat-input parts.
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