METHOD FOR MANUFACTURING LEAD FRAME FOR LED USING PALLADIUM-PLATED SUBSTRATE

摘要

Disclosed is a method for manufacturing a lead frame for an LED by using a palladium-plated substrate, which comprises the steps of: (a) subjecting a metal plate to punching processing to form a plurality of lead areas including at least one pin; (b) bending the lead areas formed through the step (a) to produce a substrate; (c) forming an electroplated layer including a palladium-plated layer on the substrate produced through the step (b); (d) injection-molding a white composite resin on the substrate where the electroplated layer is formed through the step (c) to form a reflector; (e) injecting a composite resin on the external surface of the reflector produced through the step (d) to form an insulation case; and (f) downwardly bending a pin toward the insulation case in the lead areas on the substrate where the insulation case is formed through the step (e). The lead frame for an LED manufactured through the disclosed steps uses a substrate where a nickel-plated layer, a palladium-plated layer and a gold-plated layer are uniformly formed in a sequence, thereby having excellent heat resistance, moisture resistance and chemical resistance.;COPYRIGHT KIPO 2018