A positive photosensitive resin composition, an uncured resin pattern formed by the resin composition, a cured resin pattern, a semiconductor device using the same, and a method of manufacturing the same

摘要

The present invention provides a cured resin pattern which is highly sensitive to the i-line of a mercury lamp, has excellent chemical resistance to strongly acidic aqueous solution and strongly alkaline aqueous solution, and particularly excellent in adhesion reliability to aluminum pad even in electroless plating process after O ₂ ashing And a method for producing a semiconductor using the resin pattern. The present invention also provides a positive photosensitive resin composition comprising the positive-type photosensitive resin composition. (a) an alkali-soluble resin, and (b) a quinone diazide compound, wherein (a) the alkali-soluble resin comprises (a1) the residue of the tetracarboxylic acid represented by the formula (1) (2) is 10 to 80 mol% of the total diamine residues, and the diamine residue represented by the formula (3) is 10 to 90 mol% of the total diamine residues %, And / or (a2) a polyimide corresponding to the above (a1). (In the formula (1), A represents a tetravalent monocyclic or bicyclic aromatic hydrocarbon group containing no hetero atom, and two or more types may be used) (2), B represents a group selected from O, S, SO ₂ , CH ₂ , CH (CH ₃ ), C (CH ₃ ) ₂ and C (CF ₃ ) ₂ , being)