首页> 外国专利> PHOTOSENSITIVE RESIN COMPOSITION METHOD FOR PRODUCING PATTERN MEMS STRUCTURE METHOD FOR PRODUCING THE STRUCTURE METHOD FOR DRY ETCHING METHOD FOR WET ETCHING MEMS SHUTTER DEVICE AND IMAGE DISPLAY APPARATUS

PHOTOSENSITIVE RESIN COMPOSITION METHOD FOR PRODUCING PATTERN MEMS STRUCTURE METHOD FOR PRODUCING THE STRUCTURE METHOD FOR DRY ETCHING METHOD FOR WET ETCHING MEMS SHUTTER DEVICE AND IMAGE DISPLAY APPARATUS

机译:制作图案MEMS结构的光敏树脂组成法制作湿蚀刻MEMS快门装置和图像显示装置的干蚀刻法的结构方法

摘要

The photosensitive resin composition for an etching resist or MEMS structural member of the present invention is characterized in that (A) a carboxyl group or a phenolic hydroxyl group has a monomer unit (a1) having a moiety protected with an acid-decomposable group, , A polymer having a monomer unit (a2), a component (B), a photo acid generator, and (C) a solvent.;
机译:本发明的用于抗蚀剂或MEMS结构构件的光敏树脂组合物的特征在于,(A)羧基或酚羟基具有单体单元(a1),该单体单元具有被酸可分解基团保护的部分,具有单体单元(a2),成分(B),光产酸剂和(C)溶剂的聚合物。

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