APPLICATION LIQUID FOR FORMING FLATTED FILM AND METHOD OF PRODUCING THE SAME, METAL FOIL COIL WITH FLATTED FILM AND METHOD OF MANUFACTURING THE SAME, AND SILICA FINE PARTICLE-CONTAINING KETONE SOLVENT USED FOR THEM

摘要

To provide a flatted film formation application liquid which is used for manufacturing a metal foil coil with a flatted film allowing for formation of an electronic device by a Roll to Roll process, and which includes a phenylsilsesquioxane ladder polymer resin as a matrix, and non-aggregate silica fine particle as a filler, and enables the silica fine particle to have enhanced resistance to flaw.SOLUTION: The flatted film formation application liquid is provided that is obtained by adding acetic acid of 0.1 mol to 1 mol and organic tin of 0.005 mol to 0.05 mol as catalysts to 1 mol of phenyltrialkoxysilane in an alcohol solvent, hydrolyzing them with 2 mol to 4 mol water, dissolving a resin of a phenylsilsesquioxane ladder polymer obtained by distilling at reduced pressure an organic solvent, including one generated by hydrolysis, at a temperature of 160°C to 210°C, in a silica fine particle-containing ketone solvent.SELECTED DRAWING: None