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Method for producing a multilayer MEMS component, and corresponding multilayer MEMS component

机译:用于制造多层MEMS组件的方法以及相应的多层MEMS组件

摘要

A method for manufacturing a multi-layer MEMS component includes: providing a multi-layer substrate that has a monocrystalline carrier layer, a monocrystalline functional layer having a front side and a back side, and a bonding layer located between the back side and the carrier layer; growing a first polycrystalline layer over the front side of the monocrystalline functional layer; removing the monocrystalline carrier layer; and growing a second polycrystalline layer over the back side of the monocrystalline functional layer.
机译:一种用于制造多层MEMS部件的方法,包括:提供具有单晶载体层,具有正面和背面的单晶功能层以及位于背面和载体之间的结合层的多层基板。层;在单晶功能层的正面上方生长第一多晶层;去除单晶载体层;在单晶功能层的背面上方生长第二多晶层。

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