A hot melt adhesive film for bonding an ethylene-vinyl acetate form and a rubber includes a hot melt adhesive film layer and a release film layer. The hot melt adhesive film layer is prepared by the following raw materials in parts by weight: a 20-50 parts by weight of polyethylene-ester copolymer, a 5-15 parts by weight of rubber, a 15-55 parts by weight of thermoplastic polyolefin, a 5-20 parts by weight of tackifier and a 5-30 parts by weight of auxiliary. The release film layer is releasably adhered to the hot melt adhesive film layer.
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