Press part for supporting a mould part for encapsulating electronic components mounted on a carrier and a press comprising the press part

摘要

The present invention relates to a press part for supporting a mould part for encapsulating electronic components mounted on a carrier comprising a press block, which press block comprises a contact surface, a side facing away from the contact surface and at least one side wall connecting the contact surface and the side facing away from the contact surface, wherein the press block comprises at least two opposed elements protruding from the side wall, and wherein the side wall transposes via only a recess into each of the protruding elements. The present invention further relates to a press comprising the press part of the present invenfion.