COOLANT-BASED COOLING SYSTEM FOR THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT, AND THREE-DIMENSIONAL STACKED INTEGRATED CIRCUIT USING SAME

摘要

A three-dimensional stacked integrated circuit that comprises interposers between integrated circuits of the three-dimensional stacked integrated circuit and below the lowermost integrated circuit. A coolant travel path is provided in each of the plurality of interposers, and the plurality of coolant travel paths that are provided in the plurality of interposers are connected to each other. Or, a three-dimensional stacked integrated circuit for which the configuration of a system has been simplified as a result of coolant interacting with the outside at every layer via grooves that are formed by immersion and provided to extend to the ends of interposers, which eliminates the need for a stacking-direction circuit for making the coolant circulate.