Provided is an electromagnetic wave shielding film capable of reducing a space formed between an electronic component on a wiring board and an electromagnetic wave shielding effect. The electromagnetic wave shielding film 1 has a conductive layer 3 which is stretchable and hardly returned to its original state once stretched and an adhesive layer 4 formed on one surface of the conductive layer 3 and having an insulating property, . The conductive layer 3 is made of a conductive composition containing a resin having elasticity and having a property of being difficult to return to original state once stretched and an electrically conductive filler filled in the resin. The tensile permanent deformation of the resin is not less than 2.5% and not more than 90%.
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