Electrical performance test method of multi-material junction board

摘要

The present invention is a step of bonding a plurality of single material number board having a plurality of circuit units on one production board, obtaining position information of the circuit unit of each single material board, flying probe test apparatus, Disclosing a method for testing electrical performance of a multi-material bonded substrate comprising sequentially performing electrical performance tests including measuring open and / or short circuit for each circuit unit in accordance with positional information of the circuit units . Here, the electrical performance test involves measuring whether the circuit unit is open and / or shorted. This allows the entire production board to be placed in a test device and the test can be completed at once, so as in the prior art, it is necessary to divide the production board into several smaller boards and then put them one by one into the flying probe test device to measure electrical performance. There will be no. Accordingly, the present invention can significantly reduce the process steps of the upper and lower boards in the flying probe test apparatus, thereby greatly improving work efficiency and reducing labor costs as much as possible.