首页> 外国专利> RESIN COMPOSITION FOR LIGHT GUIDE BODY PREFORM LIGHT GUIDE BODY PREFORM LAMINATE LIGHT GUIDE BODY PREFORM LIGHT GUIDE BODY FOR AREA LIGHT SOURCE DEVICE AND AREA LIGHT SOURCE DEVICE

RESIN COMPOSITION FOR LIGHT GUIDE BODY PREFORM LIGHT GUIDE BODY PREFORM LAMINATE LIGHT GUIDE BODY PREFORM LIGHT GUIDE BODY FOR AREA LIGHT SOURCE DEVICE AND AREA LIGHT SOURCE DEVICE

机译:用于面光源装置和面光源装置的光导主体的树脂组合物光导主体的坯体层状光导主体的预成型体光导主体

摘要

The present invention relates to a resin composition for light guide preforms capable of inexpensively forming a foamed layer having a large light scattering effect on the surface of a molded article by laser irradiation. More specifically, the mass average molecular weight is 60,000 to 150,000. 30% heat mass reduction temperature when carrying out thermal mass measurement at the temperature increase rate of 5 degree-C / min from resin at 100 degreeC in air is 310 degrees C or less, 40% heat mass reduction temperature, and 20% heat When thermal mass measurement is performed at a temperature increase rate of 5 ° C / min from a resin composition for a light guide preform having a difference in mass reduction temperature of 7 ° C or less, or a resin having a mass average molecular weight of 60,000 to 150,000 and nitrogen at 100 ° C. It relates to a resin composition for light guide preforms containing a silicone compound having a 90% thermal mass reduction temperature of 250 ° C or more and 650 ° C or less.
机译:本发明涉及一种用于光导预成型件的树脂组合物,该树脂组合物能够通过激光照射廉价地在成型品的表面上形成光散射效果大的发泡层。更具体地,质均分子量为60,000至150,000。在空气中以100℃从树脂以5℃/分钟的升温速度进行热质量测定时的热质量降低温度为310℃以下,热质量降低温度为40%,发热量为20%时的热质量降低温度为30%。由质量降低温度之差为7℃以下的光导预成型体用树脂组合物或质均分子量为60,000的树脂,以5℃/分钟的升温速度进行热质量测定。本发明涉及用于光导预型件的树脂组合物,该树脂组合物包含具有90%的热质量降低温度为250℃以上且650℃以下的硅氧烷化合物。

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