Leadframe assembly and manufacturing process for optoelectronic semiconductor devices

摘要

In one embodiment, the semiconductor device manufacturing method (1) comprises the following steps: A) providing a lead frame composite (2) with lead frame (22), B) equipping the lead frames (22) with optoelectronic semiconductor chips (3), C) generating a functional body (4) on the lead frame (22) and / or on the semiconductor chip (3), D) attaching an exciter coil (8) to an induction opening (28) and energizing the semiconductor chip (3) in the test field (26) by means of induction, and E) singulated to the semiconductor devices (1), wherein each of the semiconductor devices (1) comprises exactly one of the lead frames (22) from the component field (21) and the edge region (25) is discarded.