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Power semiconductor module with a switching device and power semiconductor device with such a power semiconductor module

机译:具有开关装置的功率半导体模块以及具有这种功率半导体模块的功率半导体装置

摘要

The invention relates to a power semiconductor module having a switching device which has a substrate, a power semiconductor component and a film stack, and having a pressure device which is designed to be movable in the normal direction of the substrate, wherein the film stack has a first main surface facing the substrate and a second main surface facing away from the substrate the pressure device has a pressure body and a first metal spring, wherein the pressure body exerts a force on the first metal spring in the direction of the substrate, wherein the first metal spring on a first region of the second main surface, over a first transmission area of the first main surface facing the first Metal spring, pressure in the direction of the power semiconductor component exerts and in this case the first region of the second main surface and the pressure transmitting surface of the first metal spring, in the normal direction of the substrate, above a sub Strat remote first surface of the power semiconductor device, aligned with the first surface of the line semiconductor device, are arranged.
机译:功率半导体模块技术领域本发明涉及一种功率半导体模块,该功率半导体模块具有具有衬底,功率半导体元件和膜堆叠的开关装置,并且具有压力器件,该压力器件被设计为可沿衬底的法线方向移动,其中压力装置面对着基板的第一主表面和背离基板的第二主表面具有压力体和第一金属弹簧,其中,压力体沿基板的方向在第一金属弹簧上施加力,其中在第二主表面的第一区域上的第一金属弹簧上,在面对第一金属弹簧的第一主表面的第一传递区域上,在功率半导体组件方向上施加压力,在这种情况下,第二金属表面的第一区域在衬底的法线方向上,第一金属弹簧的主表面和压力传递表面在p的次Strat远程第一表面上方布置与线半导体器件的第一表面对准的下部半导体器件。

著录项

  • 公开/公告号DE102017125052A1

    专利类型

  • 公开/公告日2019-05-02

    原文格式PDF

  • 申请/专利权人 SEMIKRON ELEKTRONIK GMBH & CO. KG;

    申请/专利号DE201710125052

  • 发明设计人 JÖRG AMMON;HARALD KOBOLLA;

    申请日2017-10-26

  • 分类号H01L23/48;H01L23/40;H01L25/07;

  • 国家 DE

  • 入库时间 2022-08-21 11:45:20

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