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METAL MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME
METAL MATERIAL FOR OPTICAL SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND OPTICAL SEMICONDUCTOR DEVICE USING THE SAME
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机译:用于光学半导体器件的金属材料,制造该金属材料的方法以及使用该金属材料的光学半导体器件
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摘要
To provide a metal material for an optical semiconductor device that has an enhanced adhesion property with a resin material, and to provide a method of manufacturing the same and an optical semiconductor device using the same.SOLUTION: Provided is a metal material for an optical semiconductor device that has, on a conductive base substance in this order: a nickel or nickel alloy plating layer; a gold or gold alloy plating layer; and an indium or indium alloy plating layer whose thickness is equal to or more than 0.002 μm and equal to or less than 0.3 μm.SELECTED DRAWING: Figure 2A
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