Method for determining stress in a substrate, lithographic process, lithographic apparatus, and control system for controlling a computer program product

摘要

A method and control system for determining stress in a substrate are disclosed. The method determines a measurement position difference between a measurement position of at least one first feature and a measurement position of at least one second feature applied to a substrate, the first feature and the second feature. The feature is placed in a single exposure image field of the lithographic apparatus used to measure the measurement position and determines the local stress in the substrate from the measured position difference. [Selection diagram] Fig. 5