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Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate
Multi-chip package structure having chip interconnection bridge which provides power connections between chip and package substrate
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机译:具有芯片互连桥的多芯片封装结构,该互连桥提供芯片与封装衬底之间的电源连接
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摘要
Multi-chip package structures and methods for constructing multi-chip package structures are provided, which utilize chip interconnection bridge devices that are designed to provide high interconnect density between adjacent chips (or dies) in the package structure, as well as provide vertical power distribution traces through the chip interconnection bridge device to supply power (and ground) connections from a package substrate to the chips connected to the chip interconnection bridge device.
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