首页> 外国专利> METHODS AND APPARATUS FOR A GLOBAL SHUTTER SCANNED, STACKED IMAGE SENSOR CAPABLE OF SIMULTANEOUS INTEGRATION OF ELECTRONS AND HOLES

METHODS AND APPARATUS FOR A GLOBAL SHUTTER SCANNED, STACKED IMAGE SENSOR CAPABLE OF SIMULTANEOUS INTEGRATION OF ELECTRONS AND HOLES

机译:能够同时集成电子和孔的全局快门倾斜的,叠置的图像传感器的方法和装置

摘要

Various embodiments of the present technology may comprise methods and apparatus for an image sensor capable of simultaneous integration of electrons and holes. According to an exemplary embodiment, the image sensor comprises a backside-illuminated hybrid bonded stacked chip image senor comprising a pixel circuit array, and each pixel circuit comprising a charge storage capacitor oriented in a vertical direction in a deep trench isolation region. Both the electrons and holes are integrated (collected) using a global shutter operation, and the charge storage capacitor is used for storing a signal generated by the holes.
机译:本技术的各种实施例可以包括用于图像传感器的方法和设备,该图像传感器能够同时集成电子和空穴。根据示例性实施例,图像传感器包括背面照明的混合键合堆叠芯片图像传感器,其包括像素电路阵列,并且每个像素电路包括在深沟槽隔离区域中沿垂直方向定向的电荷存储电容器。电子和空穴都使用全局快门操作进行积分(收集),并且电荷存储电容器用于存储空穴产生的信号。

著录项

  • 公开/公告号US2020043968A1

    专利类型

  • 公开/公告日2020-02-06

    原文格式PDF

  • 申请/专利权人 SEMICONDUCTOR COMPONENTS INDUSTRIES LLC;

    申请/专利号US201816054025

  • 发明设计人 JAROSLAV HYNECEK;

    申请日2018-08-03

  • 分类号H01L27/146;H01L27/148;H04N5/378;

  • 国家 US

  • 入库时间 2022-08-21 11:18:54

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