POLYIMIDE PRECURSOR POLYIMIDE POLYIMIDE FILM POLYIMIDE METAL LAMINATE AND POLYIMIDE SOLUTION

摘要

Polyimide precursor and polyimide using said polyimide precursor for obtaining the polyimide film which is excellent in adhesiveness with an adhesive agent and / or adhesiveness with a metal layer, and further improved heat resistance, and the polyimide film using the said polyimide This is disclosed. The polyimide precursor is represented by the following general formula (AI): (wherein A is a tetravalent aromatic group or an aliphatic group, B is a divalent aromatic group, and R ² is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms or 3 carbon atoms). It is an alkylsilyl group of -9.), And as group B in said general formula (AI), following formula (AB1): (In formula, R ¹ is a hydrogen atom and C1-C6 aliphatic. An alkyl group or an aromatic group, and R ³ represents a hydrogen atom, a methyl group or an ethyl group.