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Systems and methods for manufacturing a redistribution layer to prevent etching of the redistribution layer
Systems and methods for manufacturing a redistribution layer to prevent etching of the redistribution layer
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机译:用于制造重分布层以防止蚀刻重分布层的系统和方法
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摘要
Systems and methods for the manufacture of redistribution layers are described. There is no deposition of a seed layer of copper on the top of the substrate. The lack of seed layer avoids the need to etch the seed layer. If the seed layer is not etched, the redistribution layer, also made of copper, is not etched.
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