The present invention relates to an etching apparatus with improved discharge ability of an etchant. Accordingly, the technical aspect of the present invention is that one side of an inner protective housing is curved to smoothly discharge the etchant for etching a PCB from the etching apparatus so that the etchant can be drained into a drainage chamber along the curved surface, and the etchant drained into the drainage chamber is gathered in an outdoor tank by a pump.
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