Electroplating of a cobalt alloy and use in microelectronics

摘要

Electroplating of a cobalt alloy and use in microelectronics The present invention relates to a process for manufacturing cobalt interconnects and to an electrolyte allowing its implementation. Electrolyte with a pH of less than 4.0 includes cobalt ions, chloride ions, manganese or zinc ions, and at most two low molecular weight organic additives. One of these additives can be an alpha-hydroxy carboxylic acid.