Electroplating of a cobalt or copper alloy, and use in microelectronics

摘要

Electroplating of a cobalt or copper alloy, and use in microelectronics The present invention relates to a process for manufacturing cobalt or copper interconnections, and to an electrolyte for its implementation. Electrolyte with a pH below 4.0 includes cobalt or copper ions, chloride ions, manganese or zinc ions, and at most two low molecular weight organic additives. One of these additives can be an alpha-hydroxy carboxylic acid.